Bonding in Microsystem Technology /
Dziuban, Jan A.
Bonding in Microsystem Technology / by Jan A. Dziuban. - xviii, 331 páginas 296 ilustraciones recurso en línea. - Springer Series in Advanced Microelectronics, 24 1437-0387 ; .
Springer eBooks
Some Remarks on Microsystem Systematics and Development -- Deep, Three-Dimensional Silicon Micromachining -- Bonding -- Classification of Bonding and Closing Remarks.
Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author’s personal experience.
9781402045899
10.1007/1402045891 doi
TA405-409.3
Bonding in Microsystem Technology / by Jan A. Dziuban. - xviii, 331 páginas 296 ilustraciones recurso en línea. - Springer Series in Advanced Microelectronics, 24 1437-0387 ; .
Springer eBooks
Some Remarks on Microsystem Systematics and Development -- Deep, Three-Dimensional Silicon Micromachining -- Bonding -- Classification of Bonding and Closing Remarks.
Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author’s personal experience.
9781402045899
10.1007/1402045891 doi
TA405-409.3