VLSI-SoC: Technologies for Systems Integration :
Becker, Jürgen.
VLSI-SoC: Technologies for Systems Integration : 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, Florianópolis, Brazil, October 12-14, 2009, Revised Selected Papers / edited by Jürgen Becker, Marcelo Johann, Ricardo Reis. - x, 202 páginas recurso en línea. - IFIP Advances in Information and Communication Technology, 360 1868-4238 ; .
Springer eBooks
This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
9783642231209
10.1007/9783642231209 doi
QA76.635
VLSI-SoC: Technologies for Systems Integration : 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, Florianópolis, Brazil, October 12-14, 2009, Revised Selected Papers / edited by Jürgen Becker, Marcelo Johann, Ricardo Reis. - x, 202 páginas recurso en línea. - IFIP Advances in Information and Communication Technology, 360 1868-4238 ; .
Springer eBooks
This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
9783642231209
10.1007/9783642231209 doi
QA76.635