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Packaging of high power semiconductor lasers /

Liu, Xingsheng,

Packaging of high power semiconductor lasers / Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu. - xv, 402 páginas : 497 ilustraciones, 386 ilustraciones en color. - Micro- and Opto-Electronic Materials, Structures, and Systems .

Springer eBooks

Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging.

9781461492634

TK1001-1841
Universidad Autónoma de Nuevo León
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