Lead-Free Electronic Solders : (Registro nro. 280388)
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| 000 -CABECERA | |
|---|---|
| campo de control de longitud fija | 05860nam a22003615i 4500 |
| 001 - NÚMERO DE CONTROL | |
| campo de control | 280388 |
| 003 - IDENTIFICADOR DEL NÚMERO DE CONTROL | |
| campo de control | MX-SnUAN |
| 005 - FECHA Y HORA DE LA ÚLTIMA TRANSACCIÓN | |
| campo de control | 20170705134203.0 |
| 007 - CAMPO FIJO DE DESCRIPCIÓN FÍSICA--INFORMACIÓN GENERAL | |
| campo de control de longitud fija | cr nn 008mamaa |
| 008 - DATOS DE LONGITUD FIJA--INFORMACIÓN GENERAL | |
| campo de control de longitud fija | 150903s2007 xxu| o |||| 0|eng d |
| 020 ## - NÚMERO INTERNACIONAL ESTÁNDAR DEL LIBRO | |
| Número Internacional Estándar del Libro | 9780387484334 |
| -- | 9780387484334 |
| 024 7# - IDENTIFICADOR DE OTROS ESTÁNDARES | |
| Número estándar o código | 10.1007/9780387484334 |
| Fuente del número o código | doi |
| 035 ## - NÚMERO DE CONTROL DEL SISTEMA | |
| Número de control de sistema | vtls000331568 |
| 039 #9 - NIVEL DE CONTROL BIBLIOGRÁFICO Y DETALLES DE CODIFICACIÓN [OBSOLETO] | |
| Nivel de reglas en descripción bibliográfica | 201509030755 |
| Nivel de esfuerzo utilizado para asignar no-encabezamientos de materia en puntos de acceso | VLOAD |
| Nivel de esfuerzo utilizado en la asignación de encabezamientos de materia | 201404121904 |
| Nivel de esfuerzo utilizado para asignar clasificación | VLOAD |
| Nivel de esfuerzo utilizado en la asignación de encabezamientos de materia | 201404091632 |
| Nivel de esfuerzo utilizado para asignar clasificación | VLOAD |
| Nivel de esfuerzo utilizado en la asignación de encabezamientos de materia | 201401311420 |
| Nivel de esfuerzo utilizado para asignar clasificación | staff |
| -- | 201401301212 |
| -- | staff |
| 040 ## - FUENTE DE LA CATALOGACIÓN | |
| Centro catalogador/agencia de origen | MX-SnUAN |
| Lengua de catalogación | spa |
| Centro/agencia transcriptor | MX-SnUAN |
| Normas de descripción | rda |
| 050 #4 - CLASIFICACIÓN DE LA BIBLIOTECA DEL CONGRESO | |
| Número de clasificación | TK7800-8360 |
| 100 1# - ENTRADA PRINCIPAL--NOMBRE DE PERSONA | |
| Nombre de persona | Subramanian, K. N. |
| Término indicativo de función/relación | autor |
| 9 (RLIN) | 305287 |
| 245 10 - MENCIÓN DE TÍTULO | |
| Título | Lead-Free Electronic Solders : |
| Resto del título | A Special Issue of the Journal of Materials Science: Materials in Electronics / |
| Mención de responsabilidad, etc. | by K. N. Subramanian. |
| 264 #1 - PRODUCCIÓN, PUBLICACIÓN, DISTRIBUCIÓN, FABRICACIÓN Y COPYRIGHT | |
| Producción, publicación, distribución, fabricación y copyright | Boston, MA : |
| Nombre del de productor, editor, distribuidor, fabricante | Springer US, |
| Fecha de producción, publicación, distribución, fabricación o copyright | 2007. |
| 300 ## - DESCRIPCIÓN FÍSICA | |
| Extensión | vI, 375 páginas, |
| Otras características físicas | recurso en línea. |
| 336 ## - TIPO DE CONTENIDO | |
| Término de tipo de contenido | texto |
| Código de tipo de contenido | txt |
| Fuente | rdacontent |
| 337 ## - TIPO DE MEDIO | |
| Nombre/término del tipo de medio | computadora |
| Código del tipo de medio | c |
| Fuente | rdamedia |
| 338 ## - TIPO DE SOPORTE | |
| Nombre/término del tipo de soporte | recurso en línea |
| Código del tipo de soporte | cr |
| Fuente | rdacarrier |
| 347 ## - CARACTERÍSTICAS DEL ARCHIVO DIGITAL | |
| Tipo de archivo | archivo de texto |
| Formato de codificación | |
| Fuente | rda |
| 500 ## - NOTA GENERAL | |
| Nota general | Springer eBooks |
| 505 0# - NOTA DE CONTENIDO CON FORMATO | |
| Nota de contenido con formato | Thermodynamics and phase diagrams of lead-free solder materials -- Phase diagrams of Pb-free solders and their related materials systems -- The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints -- Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications -- Rare-earth additions to lead-free electronic solders -- Compression stress-strain and creep properties of the 52In-48Sn and 97In-3Ag low-temperature Pb-free solders -- Sn-Zn low temperature solder -- Composite lead-free electronic solders -- Processing and material issues related to lead-free soldering -- Interfacial reaction issues for lead-free electronic solders -- Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys -- Deformation behavior of tin and some tin alloys -- Mechanical fatigue of Sn-rich Pb-free solder alloys -- Life expectancies of Pb-free SAC solder interconnects in electronic hardware -- Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environments -- Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages -- Electromigration issues in lead-free solder joints -- Stress analysis of spontaneous Sn whisker growth -- Sn-whiskers: truths and myths -- Tin pest issues in lead-free electronic solders -- Issues related to the implementation of Pb-free electronic solders in consumer electronics -- Impact of the ROHS directive on high-performance electronic systems -- Impact of the ROHS Directive on high-performance electronic systems. |
| 520 ## - SUMARIO, ETC. | |
| Sumario, etc. | In the last few decades the effect of lead contamination on human health has received significant attention. Based on such concerns, elimination of lead from ceramic glaze, paint, plumbing etc. has been legislated and implemented. However, until recently, solders used in electronics, based on suitability and knowledge-base developed over a long period of time, remained lead-based. Successive rapid advances in microelectronic devices in recent decades make them obsolete within a very short period after their introduction resulting in significant quantities of electronic wastes in landfills. Leaching of toxic lead from such electronic wastes can result in contamination of the human food chain causing serious health hazards. As a consequence, several European and Pacific Rim countries have passed legislations warranting elimination of lead from electronic solders by fast approaching deadlines. Global economic pressures brought on by such legislations have resulted in a flurry of research activities to find suitable lead-free substitutes for the traditional leaded electronic solders. The worldwide multi-faceted research efforts to arrive at suitable solutions, especially as the deadline for implementation of lead-free electronic solders approaches, have resulted in an exhaustive number of research papers in several reviewed scientific journals. Similarly there have been presentations in several national and international meetings of various technical societies. It is impossible for any researcher or student to be aware of all the materials that have been, and are being, published in this area. So it becomes essential to have most of the relevant and currently available information in a single source. With this goal in mind, the important issues that are encountered in the lead-free electronic solder area were identified, and researchers recognized for their significant scientific contributions in those areas, were invited to write articles on those topics. They were asked to address the importance of a given issue, the current status of understanding and available solutions, the problems that still need to be tackled and suggestions for potential approaches to do so. This book contains the papers that were invited for a special issue of Journal of Electronic Materials: Materials in Electronics. Because this journal may not be a regular source of scientific information for academic researchers in fields other than Materials Science and those in industry, and to provide wider awareness of the current status of lead-free electronic solders to those persons active in the area but who are not regular readers of the Journal, these articles have been reprinted in this book. |
| 590 ## - NOTA LOCAL (RLIN) | |
| Nota local | Para consulta fuera de la UANL se requiere clave de acceso remoto. |
| 710 2# - PUNTO DE ACCESO ADICIONAL--NOMBRE DE ENTIDAD CORPORATIVA | |
| Nombre de entidad corporativa o nombre de jurisdicción como elemento de entrada | SpringerLink (Servicio en línea) |
| 9 (RLIN) | 299170 |
| 776 08 - ENTRADA/ENLACE A UN FORMATO FÍSICO ADICIONAL | |
| Información de relación/Frase instructiva de referencia | Edición impresa: |
| Número Internacional Estándar del Libro | 9780387484310 |
| 856 40 - LOCALIZACIÓN Y ACCESO ELECTRÓNICOS | |
| Identificador Uniforme del Recurso | <a href="http://remoto.dgb.uanl.mx/login?url=http://dx.doi.org/10.1007/978-0-387-48433-4">http://remoto.dgb.uanl.mx/login?url=http://dx.doi.org/10.1007/978-0-387-48433-4</a> |
| Nota pública | Conectar a Springer E-Books (Para consulta externa se requiere previa autentificación en Biblioteca Digital UANL) |
| 942 ## - ELEMENTOS DE PUNTO DE ACCESO ADICIONAL (KOHA) | |
| Tipo de ítem Koha | Recurso en línea |
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