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MEMS and Nanotechnology, Volume 5 : Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics / edited by Gordon Shaw III, Barton C. Prorok, LaVern Starman, Cosme Furlong.

Por: Colaborador(es): Tipo de material: TextoTextoSeries Conference Proceedings of the Society for Experimental Mechanics SeriesEditor: Cham : Springer International Publishing : Imprint: Springer, 2014Descripción: viii, 134 páginas 124 ilustraciones recurso en líneaTipo de contenido:
  • texto
Tipo de medio:
  • computadora
Tipo de portador:
  • recurso en línea
ISBN:
  • 9783319007809
Formatos físicos adicionales: Edición impresa:: Sin títuloClasificación LoC:
  • T174.7
Recursos en línea:
Contenidos:
From the Contents: Warpage Measurement of Simulated Electronic Packaging Assembly -- Nanomechanical Characterization of Lead Free Solder Joints -- In-Situ Surface Mount Process Characterization Using Digital Image Correlation -- Acoustic Waveform Energy as an Interconnect Damage Indicator -- Shape Optimization of Cantilevered Piezoelectric Devices -- Unique Fabrication Method for Novel MEMS Micro-contact Structure -- A Frequency Selective Surface Design Fabricated With Tunable RF Meta-atoms -- Stress Characterization in Si/SiO2 Spherical Shells Used in Micro-Robotics.
Resumen: MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering.  The collection presents early findings and case studies on a wide range of areas, including:   Microelectronics Packaging Single Atom/Molecule Mechanical Testing MEMS Devices & Fabrication In-Situ Mechanical Testing Nanoindentation Experimental Analysis of Low-Dimensional Materials for Nanotechnology
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From the Contents: Warpage Measurement of Simulated Electronic Packaging Assembly -- Nanomechanical Characterization of Lead Free Solder Joints -- In-Situ Surface Mount Process Characterization Using Digital Image Correlation -- Acoustic Waveform Energy as an Interconnect Damage Indicator -- Shape Optimization of Cantilevered Piezoelectric Devices -- Unique Fabrication Method for Novel MEMS Micro-contact Structure -- A Frequency Selective Surface Design Fabricated With Tunable RF Meta-atoms -- Stress Characterization in Si/SiO2 Spherical Shells Used in Micro-Robotics.

MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering.  The collection presents early findings and case studies on a wide range of areas, including:   Microelectronics Packaging Single Atom/Molecule Mechanical Testing MEMS Devices & Fabrication In-Situ Mechanical Testing Nanoindentation Experimental Analysis of Low-Dimensional Materials for Nanotechnology

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