Liu, Xingsheng, <br/><br/>
Packaging of high power semiconductor lasers / 
Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu. 
 - xv, 402 páginas :  497 ilustraciones, 386 ilustraciones en color. 
 - Micro- and Opto-Electronic Materials, Structures, and Systems .
<br/><br/> Springer eBooks 
<br/><br/>Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging. 
<br/><br/><label>ISBN: </label>9781461492634 
<br/><br/><label>LC Class. No.: </label>TK1001-1841