Arbitrary modeling of tsvs for 3d integrated circuits / Khaled Salah, Yehea Ismail, Alaa El-Rouby.
Tipo de material:
TextoSeries Analog Circuits and Signal ProcessingEditor: Cham : Springer International Publishing : Springer, 2015Descripción: ix, 179 páginas : 159 ilustraciones, 99 ilustraciones en colorTipo de contenido: - texto
- computadora
- recurso en línea
- 9783319076119
- TK7888.4
Contenidos:
Introduction: Work around Moore’s Law -- 3D/TSV Enabling Technologies -- TSV Modeling and Analysis -- TSV Verification -- TSV Macro-Modeling Framework -- TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications and TSV-Based Bandpass Filter -- Imperfection in TSV Modeling -- New Trends in TSV -- TSV Fabrication -- Conclusions.
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Introduction: Work around Moore’s Law -- 3D/TSV Enabling Technologies -- TSV Modeling and Analysis -- TSV Verification -- TSV Macro-Modeling Framework -- TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications and TSV-Based Bandpass Filter -- Imperfection in TSV Modeling -- New Trends in TSV -- TSV Fabrication -- Conclusions.
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