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001			277169
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008			150903s2006 xxu| o |||| 0|eng d
020			_a9780387297491 _99780387297491
024	7		_a10.1007/0387297499 _2doi
035			_avtls000330774
039		9	_a201509030725 _bVLOAD _c201404120529 _dVLOAD _c201404090310 _dVLOAD _c201401311351 _dstaff _y201401301154 _zstaff
040			_aMX-SnUAN _bspa _cMX-SnUAN _erda
050		4	_aTK7888.4
100	1		_aVassighi, Arman. _eautor _9299705
245	1	0	_aThermal and Power Management of Integrated Circuits / _cby Arman Vassighi, Manoj Sachdev.
264		1	_aBoston, MA : _bSpringer US, _c2006.
300			_ax, 179 páginas, _brecurso en línea.
336			_atexto _btxt _2rdacontent
337			_acomputadora _bc _2rdamedia
338			_arecurso en línea _bcr _2rdacarrier
347			_aarchivo de texto _bPDF _2rda
490	0		_aSeries on Integrated Circuits and Systems, _x1558-9412
500			_aSpringer eBooks
505	0		_aPower, Junction Temperature, and Reliability -- Burn-in as a Reliability Screening Test -- Thermal and Electrothermal Modeling -- Thermal Runaway and Thermal Management -- Low Temperature CMOS Operation.
520			_aThermal modeling of high performance circuits and systems is a crucial component for thermal and power management. The VLSI community is currently lacking a methodology to model and estimate junction temperature at any level of design other than low-level (transistor-level) circuits. The accuracy of thermal modeling has a substantial effect on the accuracy of thermal-management studies at the architectural level. Without this essential modeling capability, architecture researchers are limited to inaccurate estimation techniques, which are not suitable for thermal management of integrated circuits. In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
590			_aPara consulta fuera de la UANL se requiere clave de acceso remoto.
700	1		_aSachdev, Manoj. _eautor _9299706
710	2		_aSpringerLink (Servicio en línea) _9299170
776	0	8	_iEdición impresa: _z9780387257624
856	4	0	_uhttp://remoto.dgb.uanl.mx/login?url=http://dx.doi.org/10.1007/0-387-29749-9 _zConectar a Springer E-Books (Para consulta externa se requiere previa autentificación en Biblioteca Digital UANL)
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999			_c277169 _d277169