000 03898nam a22003615i 4500
001 279390
003 MX-SnUAN
005 20160429153944.0
007 cr nn 008mamaa
008 150903s2009 xxu| o |||| 0|eng d
020 _a9780387793948
_99780387793948
024 7 _a10.1007/9780387793948
_2doi
035 _avtls000333018
039 9 _a201509030759
_bVLOAD
_c201404122328
_dVLOAD
_c201404092107
_dVLOAD
_y201402041100
_zstaff
040 _aMX-SnUAN
_bspa
_cMX-SnUAN
_erda
100 1 _aPerkins, Andrew E.
_eautor
_9303688
245 1 0 _aSolder Joint Reliability Prediction for Multiple Environments /
_cby Andrew E. Perkins, Suresh K. Sitaraman.
264 1 _aBoston, MA :
_bSpringer US,
_c2009.
300 _axvI, 192 páginas 70 ilustraciones
_brecurso en línea.
336 _atexto
_btxt
_2rdacontent
337 _acomputadora
_bc
_2rdamedia
338 _arecurso en línea
_bcr
_2rdacarrier
347 _aarchivo de texto
_bPDF
_2rda
500 _aSpringer eBooks
505 0 _aBackground -- Literature Review -- Unified Finite Element Modeling for Prediction of Solder Joint Fatigue -- Validation of Unified FEM for Thermal Cycling and Power -- Development of Fatigue Life Equations Under Low-Cycle Thermal and Power Cycling -- Validation of Unified FEM and Development of Fatigue-life Equations for Vibration -- Universal Predictive Fatigue Life Equation and the Effect of Design Parameters -- Acceleration Factor to Relate Thermal Cycles to Power Cycles for CBGA Packages -- Solder Joint Fatigue Failure under Sequential Thermal and Vibration Environments -- Solder Joint Reliability Assessment for Desktop and Space Applications.
520 _aSolder Joint Reliability Prediction for Multiple Environments provides industry engineers, graduate students, academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries. Drawing upon years of practical experience and using numerous examples and illustrative applications, Andrew Perkins and Suresh Sitaraman cover state of the art technologies in solder joint reliability, including: A comprehensive summary of current literature on lead-containing ceramic area array electronic package solder joining reliability, Useful and easy-to-use tools for predicting solder joint fatigue life under thermal cycling, and power cycling enviroments, New insight into solder joint reliability testing under multiple environments, including vibration environments, A methodology for predicting solder joint reliability using numerical simulations and experimental data under multiple environments that can be related to any package type. Solder Joint Reliability Prediction for Multiple Environments is a must have book for practitioners and researchers who specialize in solder.
590 _aPara consulta fuera de la UANL se requiere clave de acceso remoto.
700 1 _aSitaraman, Suresh K.
_eautor
_9303689
710 2 _aSpringerLink (Servicio en línea)
_9299170
776 0 8 _iEdición impresa:
_z9780387793931
856 4 0 _uhttp://remoto.dgb.uanl.mx/login?url=http://dx.doi.org/10.1007/978-0-387-79394-8
_zConectar a Springer E-Books (Para consulta externa se requiere previa autentificación en Biblioteca Digital UANL)
942 _c14
999 _c279390
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