| 000 | 03160nam a22004335i 4500 | ||
|---|---|---|---|
| 001 | 286075 | ||
| 003 | MX-SnUAN | ||
| 005 | 20170705134212.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 150903s2011 xxu| o |||| 0|eng d | ||
| 020 |
_a9781441957603 _99781441957603 |
||
| 024 | 7 |
_a10.1007/9781441957603 _2doi |
|
| 035 | _avtls000338477 | ||
| 039 | 9 |
_a201509030815 _bVLOAD _c201404300346 _dVLOAD _y201402060911 _zstaff |
|
| 040 |
_aMX-SnUAN _bspa _cMX-SnUAN _erda |
||
| 050 | 4 | _aTK7800-8360 | |
| 100 | 1 |
_aLiu, Johan. _eautor _9314560 |
|
| 245 | 1 | 0 |
_aReliability of Microtechnology : _bInterconnects, Devices and Systems / _cby Johan Liu, Olli Salmela, Jussi Sarkka, James E. Morris, Per-Erik Tegehall, Cristina Andersson. |
| 250 | _a1. | ||
| 264 | 1 |
_aNew York, NY : _bSpringer New York, _c2011. |
|
| 300 |
_axiii, 204 páginas 50 ilustraciones _brecurso en línea. |
||
| 336 |
_atexto _btxt _2rdacontent |
||
| 337 |
_acomputadora _bc _2rdamedia |
||
| 338 |
_arecurso en línea _bcr _2rdacarrier |
||
| 347 |
_aarchivo de texto _bPDF _2rda |
||
| 500 | _aSpringer eBooks | ||
| 505 | 0 | _aIntroduction to Reliability and its Importance -- Reliability Metrology -- General Failure Mechanisms of Microsystems -- Solder and Conductive Adhesive Joint Reliability -- Accelerated Testing -- Reliability Design for Manufacturability -- Component Reliability -- System Level Reliability -- Reliability and Quality Management of Microsystem -- Experimental Tools for Reliability Analysis. | |
| 520 | _aReliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also: Discusses the general failure mechanisms of microsystems on a component level Offers comprehensive coverage of solder joint reliability at the microsystems level Analyzes?quality issues and manufacturing at the microsystems level Reliability of Microtechnology is an ideal volume for researchers and professional engineers working in reliability and manufacturing. The book also includes exercises and detailed solutions at the end of each chapter. | ||
| 590 | _aPara consulta fuera de la UANL se requiere clave de acceso remoto. | ||
| 700 | 1 |
_aSalmela, Olli. _eautor _9314561 |
|
| 700 | 1 |
_aSarkka, Jussi. _eautor _9314562 |
|
| 700 | 1 |
_aMorris, James E. _eautor _9304429 |
|
| 700 | 1 |
_aTegehall, Per-Erik. _eautor _9314563 |
|
| 700 | 1 |
_aAndersson, Cristina. _eautor _9314564 |
|
| 710 | 2 |
_aSpringerLink (Servicio en línea) _9299170 |
|
| 776 | 0 | 8 |
_iEdición impresa: _z9781441957597 |
| 856 | 4 | 0 |
_uhttp://remoto.dgb.uanl.mx/login?url=http://dx.doi.org/10.1007/978-1-4419-5760-3 _zConectar a Springer E-Books (Para consulta externa se requiere previa autentificación en Biblioteca Digital UANL) |
| 942 | _c14 | ||
| 999 |
_c286075 _d286075 |
||