000			03377nam a22004335i 4500
001			287441
003			MX-SnUAN
005			20160429154548.0
007			cr nn 008mamaa
008			150903s2012 xxk| o |||| 0|eng d
020			_a9781447124702 _99781447124702
024	7		_a10.1007/9781447124702 _2doi
035			_avtls000339597
039		9	_a201509030317 _bVLOAD _c201404300402 _dVLOAD _y201402060939 _zstaff
040			_aMX-SnUAN _bspa _cMX-SnUAN _erda
050		4	_aT174.7
100	1		_aLaurila, Tomi. _eautor _9316623
245	1	0	_aInterfacial Compatibility in Microelectronics : _bMoving Away from the Trial and Error Approach / _cby Tomi Laurila, Vesa Vuorinen, Mervi Paulasto-Kröckel, Markus Turunen, Toni T. Mattila, Jorma Kivilahti.
264		1	_aLondon : _bSpringer London, _c2012.
300			_aIx, 217 páginas 128 ilustraciones, 15 ilustraciones en color. _brecurso en línea.
336			_atexto _btxt _2rdacontent
337			_acomputadora _bc _2rdamedia
338			_arecurso en línea _bcr _2rdacarrier
347			_aarchivo de texto _bPDF _2rda
490	0		_aMicrosystems, _x1389-2134
500			_aSpringer eBooks
505	0		_aIntroduction: Away from trial and error methods -- Materials and interfaces in Microsystems -- Introduction to mechanics of materials -- Introduction to thermodynamic-kinetic method -- Interfacial adhesion in polymer systems -- Evolution of different types of interfacial structures.
520			_aInterfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: •solutions to several common reliability issues in microsystem technology, •methods to understand and predict failure mechanisms at interfaces between dissimilar materials and •an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.
590			_aPara consulta fuera de la UANL se requiere clave de acceso remoto.
700	1		_aVuorinen, Vesa. _eautor _9316624
700	1		_aPaulasto-Kröckel, Mervi. _eautor _9316625
700	1		_aTurunen, Markus. _eautor _9316626
700	1		_aMattila, Toni T. _eautor _9316627
700	1		_aKivilahti, Jorma. _eautor _9316628
710	2		_aSpringerLink (Servicio en línea) _9299170
776	0	8	_iEdición impresa: _z9781447124696
856	4	0	_uhttp://remoto.dgb.uanl.mx/login?url=http://dx.doi.org/10.1007/978-1-4471-2470-2 _zConectar a Springer E-Books (Para consulta externa se requiere previa autentificación en Biblioteca Digital UANL)
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999			_c287441 _d287441