000 03047nam a22003735i 4500
001 305685
003 MX-SnUAN
005 20170705134307.0
007 cr nn 008mamaa
008 150903s2012 gw | o |||| 0|eng d
020 _a9783642285226
_99783642285226
024 7 _a10.1007/9783642285226
_2doi
035 _avtls000358785
039 9 _a201509030609
_bVLOAD
_c201405070236
_dVLOAD
_y201402191540
_zstaff
040 _aMX-SnUAN
_bspa
_cMX-SnUAN
_erda
050 4 _aT174.7
100 1 _aGerlach, Gerald.
_eeditor.
_9333702
245 1 0 _aBio and Nano Packaging Techniques for Electron Devices :
_bAdvances in Electronic Device Packaging /
_cedited by Gerald Gerlach, Klaus-Jürgen Wolter.
264 1 _aBerlin, Heidelberg :
_bSpringer Berlin Heidelberg :
_bImprint: Springer,
_c2012.
300 _axii, 628 páginas 351 ilustraciones, 60 ilustraciones en color.
_brecurso en línea.
336 _atexto
_btxt
_2rdacontent
337 _acomputadora
_bc
_2rdamedia
338 _arecurso en línea
_bcr
_2rdacarrier
347 _aarchivo de texto
_bPDF
_2rda
500 _aSpringer eBooks
505 0 _aGeneral Aspects -- 3D Modelling and Design for Nems -- Nanoparticles -- Nanopatterning -- Metallization -- Nano- and Bio-Functionalized Surfaces -- Biocompatible Packaging -- Thermal Management -- System-In-Package For Mems and Moems.
520 _aThe book offers a comprehensive discussion of future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes effects of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and their opportunities for packaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed and also shows ways for implementation. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces are demonstrated. Also new packaging technologies with high potential for industrial applications like nano partical fabrication and application, nano imprinting and ink-jet printing are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers as well as practicing engineers seeking information about the latest nano and bio techniques in packaging.
590 _aPara consulta fuera de la UANL se requiere clave de acceso remoto.
700 1 _aWolter, Klaus-Jürgen.
_eeditor.
_9322964
710 2 _aSpringerLink (Servicio en línea)
_9299170
776 0 8 _iEdición impresa:
_z9783642285219
856 4 0 _uhttp://remoto.dgb.uanl.mx/login?url=http://dx.doi.org/10.1007/978-3-642-28522-6
_zConectar a Springer E-Books (Para consulta externa se requiere previa autentificación en Biblioteca Digital UANL)
942 _c14
999 _c305685
_d305685