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020 _a9789048138074
_99789048138074
024 7 _a10.1007/9789048138074
_2doi
035 _avtls000365462
039 9 _a201509030653
_bVLOAD
_c201405070413
_dVLOAD
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040 _aMX-SnUAN
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_cMX-SnUAN
_erda
050 4 _aTP248.13-248.65
100 1 _aGusev, Evgeni.
_eeditor.
_9301677
245 1 0 _aAdvanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators /
_cedited by Evgeni Gusev, Eric Garfunkel, Arthur Dideikin.
246 3 _aProceedings of the NATO Advanced Research Worskhop on Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators St. Petersburg, Russia 29 June - 2 July 2008
264 1 _aDordrecht :
_bSpringer Netherlands,
_c2010.
300 _aIx, 313 páginas
_brecurso en línea.
336 _atexto
_btxt
_2rdacontent
337 _acomputadora
_bc
_2rdamedia
338 _arecurso en línea
_bcr
_2rdacarrier
347 _aarchivo de texto
_bPDF
_2rda
490 0 _aNATO Science for Peace and Security Series B: Physics and Biophysics,
_x1874-6500
500 _aSpringer eBooks
505 0 _aMEMS/NEMS Technologies and Applications -- History of Early Research on MEMS in Russia (U.S.S.R.) -- Challenges of Complete CMOS/MEMS Systems Integration -- MEMS for Practical Applications -- Nanochip: A MEMS-Based Ultra-High Data Density Memory Device -- Low Cost Silicon Coriolis’ Gyroscope Paves the Way to Consumer IMU -- Microwave and Millimetre Wave Devices Based on Micromachining of III-V Semiconductors -- Monocrystalline-Silicon Microwave MEMS Devices -- Three-Dimensional Photonic Crystals Based on Opal-Semiconductor and Opal-Metal Nanocomposites -- MEMS Device and Reliability Physics -- Pull-in Dynamics of Electrostatically Actuated Bistable Micro Beams -- Path Following and Numerical Continuation Methods for Non-Linear MEMS and NEMS -- The Impact of Dielectric Material and Temperature on Dielectric Charging in RF MEMS Capacitive Switches -- Advanced Processes and Materials -- Development of DRIE for the Next Generation of MEMS Devices -- Low-Temperature Processes for MEMS Device Fabrication -- High-Temperature Stable Au–Sn and Cu–Sn Interconnects for 3D Stacked Applications -- 3D Integration of MEMS and IC: Design, Technology and Simulations -- Low-Frequency Electronic Noise in the Back-Gated and Top-Gated Graphene Devices -- Modeling of Dry Etching in Production of MEMS -- XRD and Raman Study of Low Temperature AlGaAs/GaAs (100) Heterostructures -- Internal Stresses in Martensite Formation in Copper Based Shape Memory Alloys -- Sensors -- Smart Sensors: Advantages and Pitfalls -- Vertically Integrated MEMS SOI Composite Porous Silicon-Crystalline Silicon Cantilever-Array Sensors: Concept for Continuous Sensing of Explosives and Warfare Agents -- Integration of Diverse Biological Materials in Micro/Nano Devices -- Force Sensing Optimization and Applications -- Using Parametric Resonance to Improve Micro Gyrsocope Robustness.
520 _aThe main goal of this book is to review recent progress and current status of MEMS/NEMS technologies and devices. Several important areas are discussed: history of research in the field, device physics, examples of sucessful applications, sensors, materials and processing aspects. The authors who have contributed to the book represent a diverse group of leading scientists from academic, industrial and governmental labs worldwide who bring a broad array of backgrounds such as device physics, technologists, electrical and mechanical engineering, surface chemistry and materials science). The contributions to this book are accessible to both expert scientists and engineers who need to keep up with leading edge research, and newcomers to the field who wish to learn more about the exciting basic and applied research issues relevant to micromechanical devices and technologies.
590 _aPara consulta fuera de la UANL se requiere clave de acceso remoto.
700 1 _aGarfunkel, Eric.
_eeditor.
_9354859
700 1 _aDideikin, Arthur.
_eeditor.
_9354860
710 2 _aSpringerLink (Servicio en línea)
_9299170
776 0 8 _iEdición impresa:
_z9789048138050
856 4 0 _uhttp://remoto.dgb.uanl.mx/login?url=http://dx.doi.org/10.1007/978-90-481-3807-4
_zConectar a Springer E-Books (Para consulta externa se requiere previa autentificación en Biblioteca Digital UANL)
942 _c14
999 _c312885
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