Packaging of high power semiconductor lasers / Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu.
Tipo de material:
TextoSeries Micro- and Opto-Electronic Materials, Structures, and SystemsEditor: New York, NY : Springer New York : Springer, 2015Descripción: xv, 402 páginas : 497 ilustraciones, 386 ilustraciones en colorTipo de contenido: - texto
- computadora
- recurso en línea
- 9781461492634
- TK1001-1841
Springer eBooks
Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging.
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